Extrusion Cooling

Extrusion Cooling Simulations

With recently developed software, we are now able to perform very accurate extrusion cooling simulations.

These simulations can be used to optimize:

  • cooling technologies like internal cooling
  • vacuum and cooling lengths
  • residual stress in finished products.

The software I use was developed by SHS Plus GmbH, based in Dinslaken Germany. This is a plastics processing Engineering Firm focusing on Consulting, Software, Training. SHS Plus Website

chillWARE is used by some of the leading extrusion systems manufacturers across Europe and North America, as well as leading processors and process consultants. The German industry publication, Plastverarbeiter, named chillWARE the product of the year in both 2016 and 2017.

This is powerful software, and if you are looking for an edge, let’s work together to set up a new line, or optimize an existing line.

Here is an hypothetical Challenge:

With limited building length, and limited active cooling length available, find out what is the best throughput one can expect for a given size HDPE Pipe. The equipment investment would be significant, so guessing would not be an option.


The Results:

Slide 1: Temperature plot using the maximum throughput available with the limited cooling length, cold water, and no internal air cooling

Slide 2: Incorporates internal air cooling, and also tempered water for a slower OD cooling.  Throughput actually doubled in this case
Slide 3: Compare residual stress from process 1 (Slide 1) and process 2 (Slide 2) Reduced residual stress with process 2, and double the throughput

Slide 1:

The red line is the temperature of the Ppipe ID. It is the hottest part of the pipe.

The green line is the pipe OD. It is the coldest part of the pipe.

Slide 2:

With internal cooling, note that the red line (pipe ID) is no longer the hottest area.

The green line (pipe OD) is still the coldest.

Tempering the water a bit, brings the ID temperature (with internal air cooling) and the OD temperature (with warmer water) closer together which helps reduce residual stress.

The blue line is the internal air temperature.

The result of adding the internal cooling is that a processor could DOUBLE the throughput, in the same cooling distance, using internal air cooling.

Slide 3:

Bringing the OD and ID temperatures closer together, and slowing the potential cooling somewhat, reduces the residual stress in the pipe. The red is the stress from Slide 2, and with double the throughput.

Contact us now

Reach out, and we can start buy validating the software against one of your current lines to give you the confidence in the simulations.

From there, we can go to work with confidence.